X350 Vacuum Hot Pressing Forming Machine is widely used for bonding hard plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc. Stable heating with maximum temperature of 350 degrees Celsius. Heating time and temperature can be precisely controlled. Visualizing the temperature change curve can achieve the experimental purpose more intuitively.

The Vacuum Hot Pressing Forming Machine designed for the preparation of microfluidic chips is specifically used for bonding plastic chips (such as PMMA, PC, COC, etc.) to achieve chip encapsulation and integration. This bonding machine employs vacuum hot press technology, characterized by high efficiency, precision, and reliability, making it suitable for various packaging and integration requirements.

The Vacuum Hot Pressing Forming Machine is suitable for various microfluidic chip preparation needs, especially for bonding applications involving plastic chips. This product is characterized by efficiency, precision, and reliability, providing a high-quality solution for chip preparation and packaging.

The X350 vacuum hot press bonding machine can meet vacuum needs and adjust the pressure range at any time. Ten-segment heating control. The simple and intuitive color LCD touch control screen makes your work efficiency one step faster.

The X350 Vacuum Hot Pressing Forming Machine is commonly used for thermal bonding of microfluidic chips such as PMMA (acrylic), PC (polycarbonate), PP (polypropylene), COP (cyclo olefin polymer), COC (cyclo olefin copolymer), etc. Pressure seal.

Related processing business:

1..R&D, manufacturing and sales of vacuum hot press bonding machines (mainly for medium-low and high-temperature bonding of plastics, silicon wafers, quartz and other substrates)

2.Microfluidic chip (PMMA\PC\PP\COC\COP\PEI and other materials) processing and sealing (hot pressing/adhesive/laser/ultrasonic)

3.Mold injection molding of plastic-based material chips.

4. Batch sealing of plastic-based chips (hot pressing process)

The Vacuum Hot Pressing Forming Machine Has Several Main Features

Vacuum Hot Press Technology

The bonding machine employs vacuum hot press technology, ensuring high-quality bonding results. The vacuum environment eliminates bubbles from the air, preventing damage to the chips during bonding. The heat and pressure ensure complete fusion between the materials, forming a strong bond.

High Precision and Stability

The machine utilizes high-precision and highly stable mechanical and electronic components, enabling high-precision bonding operations to ensure the quality of the bond between chips. Its stability is also high, meeting the requirements of long-duration continuous operation.

Diverse Bonding Modes

The machine offers diverse bonding modes to accommodate various chip materials and bonding requirements. For instance, users can choose different parameters such as temperature, pressure, and time to adapt to different bonding materials and sizes.

Features

1) Controllable constant temperature heating technology, temperature control is accurate to plus or minus 1 degree Celsius.

2) 7-inch color touch screen with ten-stage heating settings for user-friendly operation.

3) The cylinder delay automatic lifting function can be set (optional function)

4) Real-time temperature curve display, temperature changes are more intuitive.

5) Using a 500KG cylinder to achieve precise pressure adjustment from 0-400KG (maximum pressure 4KN). Meet different pressure needs. (Note: Cylinders with other pressures can be customized according to customer needs)

6) The cavity is made of special insulation materials, which has higher heating efficiency, more even heating of the product, and more energy-saving equipment.

7) Vacuum cavity to improve hot pressing efficiency and success rate.

Technical parameters of X350 Vacuum Hot Pressing Forming Machine

1) Equipment dimensions: 660 (length) * 380 (width) * 820 (height) mm

2) Weight: 95KG

3) Effective heating platform: 180mm*160mm (platform size 220mm*200mm)

4) Maximum temperature rise: 350 degrees Celsius (sustainable operating temperature)

5) Pressure range: 0~4KN (400KG)

6) Pressure display accuracy: plus or minus 0.05KN

7) Rated power: 1.3kw

8) Rated voltage: AC220V/50HZ

9) Temperature control range: room temperature ~ 350 degrees Celsius

10) Temperature control accuracy: ±1 degrees Celsius

11) Maximum platform temperature difference: 3 degrees Celsius

12) Maximum heating rate: 3 degrees Celsius/minute

13) Vacuum degree-0.1MP (standard vacuum pump parameters)